Polyimides

P96/P26

La nouvelle alternative Polyimide P96 et son Pre-Preg P26

En savoir plus

Isola est heureux de vous présenter sa gamme de produits à base polyimide laminés P96 et
prepreg P26.

Cette nouvelle gamme de produits polyimides est très spécifiquement dédiée aux applications
liées à la fabrication de circuits imprimés haute température. Ces produits constitués d'un
système de résines polyimides à haute résistance thermique sont parfaitement appropriés aux
secteurs industriel et militaire où les applications exigent des performances supérieures et une
grande stabilité aux températures extrêmes. Ces produits sont le résultat de la combinaison de
résines polyimide et thermoplastique, entièrement dépourvue de Methylenedianiline (MDA). Le
résultat est l'obtention d'un polymère à haut Tg (260°) palliant aux difficultés caractéristiques de
fragilité et ayant un coefficient d'expansion initial très faible associés aux propriétés thermiques
traditionnelles des polymides.

Quelques données techniques :

  • Conforme aux normes RoHS
  • Agréments IPC-4101C /40/41/42
  • Agréments UL E41625
  • Epaisseurs disponibles des laminés de 0.05 mm à 3,2 mm
  • Epaisseurs de cuivre standard : 18, 38 et 70 microns
  • Epaisseurs de cuivre non standard : disponible sur demande
  • Prepreg et laminés disponibles en planches ou en formats
Fiche technique
Caracteristiques Valeur typique [Specifications] (Certification)
Glass Transition (Tg) by DSC 260°C [250] (IPC-TM-650 2.4.25)
Decomposition (Td) by TGA @ 5% weight loss 416°C (ASTM D3850)
T260 60 Minutes (ASTM D3850)
T288 60 Minutes (ASTM D3850)
CTE, Z-axis, Pre-Tg 55ppm/°C [AABUS] (IPC-TM-650 2.4.24)
CTE, X-, Y-axes, Pre-Tg 13/14ppm/°C [AABUS] (IPC-TM-650 2.4.24)
CTE, X-, Y-axes, Post-Tg 14/17ppm/°C [AABUS] (IPC-TM-650 2.4.24)
Z-axis Expansion (50-260°C) (IPC-TM-650 2.4.24)
Thermal Conductivity 0.4 W/mK (ASTM D5930)
Thermal Stress 10 sec @ 288°C (550.4°F) Unetched Pass Rating (Pass Visual) (IPC-TM-650 2.4.13.1)
Thermal Stress 10 sec @ 288°C (550.4°F) Etched Pass Rating (Pass Visual) (IPC-TM-650 2.4.13.1)
Dk, Permittivity Tested at 50% resin @ 100MHz 3.90 [5.4] (IPC-TM-650 2.5.5.3)
Dk, Permittivity Tested at 50% resin @ 1GHz 3.95 (IPC-TM-650 2.5.5.9)
Dk, Permittivity Tested at 50% resin @ 2GHz 3.76 (IPC-TM-650 2.5.5.5)
Dk, Permittivity Tested at 50% resin @ 5GHz 3.74 (IPC-TM-650 2.5.5.5)
Dk, Permittivity Tested at 50% resin @ 10GHz 3.74 (IPC-TM-650 2.5.5.5)
Df, Loss Tangent Tested at 50% resin @ 100 MHz 0.0180 [0.035] (IPC-TM-650 2.5.5.3)
Df, Loss Tangent Tested at 50% resin @ 1 GHz 0.0180 (IPC-TM-650 2.5.5.9)
Df, Loss Tangent Tested at 50% resin @ 2 GHz 0.0170 (IPC-TM-650 2.5.5.5)
Df, Loss Tangent Tested at 50% resin @ 5 GHz 0.0190 (IPC-TM-650 2.5.5.5)
Df, Loss Tangent Tested at 50% resin @ 8 GHz 0.0210 (IPC-TM-650 2.5.5.5)
Volume Resistivity 96/35/90 [1.0x10exp6] (IPC-TM-650 2.5.17.1)
Volume Resistivity After moisture resistance 3.8x10exp8 MOhms-cm (IPC-TM-650 2.5.17.1)
Volume Resistivity At elevated temperature 7.0x10exp8 MOhms-cm [1.0x10exp3] (IPC-TM-650 2.5.17.1)
Surface Resistivity 96/35/90 [1.0x10exp4] (IPC-TM-650 2.5.17.1)
Surface Resistivity After moisture resistance 3.0x10exp6 MOhms (IPC-TM-650 2.5.17.1)
Surface resistivity At elevated temperature 2.0x10exp8 MOhms [1.0x10exp3] (IPC-TM-650 2.5.17.1)
Dielectric Breakdown over 55kV (IPC-TM-650 2.5.6)
Arc Resistance 130 Seconds [60] (IPC-TM-650 2.5.1)
Electric Strength 44kV/mm 1100V/mil [30kV/mm 750V/mil] (IPC-TM-650 2.5.6.2)
Comparative Tracking Index (CTI) 4Class 100-174Volts (UL-746A ASTM D3638)
Peel Strength Low profile cooper foil and very low profile - All copper weights over 17 microns 1.14N/mm 6.5lb/inch [0.70N/mm 4.0lb/inch] (IPC-TM-650 2.4.8)
Peel Strength Standard profile cooper After thermal stress 1.25N/mm 7.0lb/inch [0.80N/mm 4.5lb/inch] (IPC-TM-650 2.4.8.3)
Peel Strength Standard profile cooper At 125 °C 1.25N/mm 7.0lb/inch [0.70N/mm 4.0lb/inch]
Peel Strength Standard profile cooper After process solutions 1.14N/mm 6.5lb/inch [0.55N/mm 3.0lb/inch]
Flexural Strength Lengthwise direction 83 600 lb/inch² (IPC-TM-650 2.4.4)
Flexural Strength Crosswise direction 55 500 lb/inch² (IPC-TM-650 2.4.4)
Tensile Strength Lengthwise direction 55 000 lb/inch²
Tensile Strength Crosswise direction 35370 lb/inch²
Moisture Absorption 0.5% (IPC-TM-650 2.6.2.1)
Flammability (Laminate & prepreg as laminated) V-0 Rating (UL 94)
Max Operating Temperature 140°C [UL Cert]
Young's Modulus Grain direction 3958ksi (ww)
Young's Modulus Fill direction 3530ksi (xx)
Poisson's Ratio Grain direction 0.189 (xx)
Poisson's Ratio Fill direction 0.154 (xx)

Les informations ci-dessus ainsi que les fiches techniques sont fournies a titre indicatif. Seuls les documents remis le jour de la vente peuvent servir de reference.

Télécharger

P96 - Data sheet
Fiche technique du P96 (US)

P26N

Le pré-preg Polyimide No Flow

En savoir plus

Présentation du produit à venir.

Fiche technique
Caracteristiques Valeur typique [Specifications] (Certification)
Glass Transition (Tg) by DSC 250°C [170-200] (IPC-TM-650 2.4.25)
Decomposition (Td) by TGA @ 5% weight loss 383°C (ASTM D3850)
T260 60 Minutes (ASTM D3850)
T288 60 Minutes (ASTM D3850)
CTE, Z-axis, Pre-Tg 55ppm/°C [AABUS] (IPC-TM-650 2.4.24)
CTE, Z-axis, Post-Tg TBDppm/°C (IPC-TM-650 2.4.24)
CTE, X-, Y-axes, Pre-Tg 13/14 ppm/°C [AABUS] (IPC-TM-650 2.4.24)
CTE, X-, Y-axes, Post-Tg 14/17 ppm/°C (IPC-TM-650 2.4.24)
Thermal Conductivity 0.4W/mK (ASTM D5930)
Thermal Stress 10 sec @ 288°C (550.4°F) Unetched Pass Rating [Pass Visual] (IPC-TM-650 2.4.13.1)
Thermal Stress 10 sec @ 288°C (550.4°F) Etched Pass Rating [Pass Visual] (IPC-TM-650 2.4.13.1)
Dk, Permittivity Tested at 50% resin @ 100MHz 3.90 [5.4] (IPC-TM-650 2.5.5.3)
Dk, Permittivity Tested at 50% resin @ 1GHz 3.95 (IPC-TM-650 2.5.5.9)
Dk, Permittivity Tested at 50% resin @ 2GHz 3.76 (IPC-TM-650 2.5.5.5)
Dk, Permittivity Tested at 50% resin @ 5GHz 3.74 (IPC-TM-650 2.5.5.5)
Dk, Permittivity Tested at 50% resin @ 10GHz 3.74 (IPC-TM-650 2.5.5.5)
Df, Loss Tangent Tested at 50% resin @ 100 MHz 0.0180 [0.035] (IPC-TM-650 2.5.5.3)
Df, Loss Tangent Tested at 50% resin @ 1 GHz 0.0180 (IPC-TM-650 2.5.5.9)
Df, Loss Tangent Tested at 50% resin @ 2 GHz 0.0170 (IPC-TM-650 2.5.5.5)
Df, Loss Tangent Tested at 50% resin @ 5 GHz 0.0190 (IPC-TM-650 2.5.5.5)
Df, Loss Tangent Tested at 50% resin @ 8 GHz 0.0210 (IPC-TM-650 2.5.5.5)
Volume Resistivity After moisture resistance 3.0x10exp8 MOhms-cm (IPC-TM-650 2.5.17.1)
Volume Resistivity At elevated temperature 7.0x10exp8 MOhms-cm [1.0x10exp3] (IPC-TM-650 2.5.17.1)
Surface Resistivity After moisture resistance 3.0x10exp6 MOhms (IPC-TM-650 2.5.17.1)
Surface resistivity At elevated temperature 2.0x10exp8 MOhms [1.0x10exp3] (IPC-TM-650 2.5.17.1)
Dielectric Breakdown over 55kV [40] (IPC-TM-650 2.5.6)
Arc Resistance 130 Seconds [60] (IPC-TM-650 2.5.1)
Electric Strength 44kV/mm 1100V/mil [30kV/mm 750V/mil] (IPC-TM-650 2.5.6.2)
Comparative Tracking Index (CTI) 4Class 100-174Volts (UL-746A ASTMD3638)
Peel Strength Low profile cooper foil and very low profile - All copper weights over 17 microns 1.14N/mm 6.5lb/inch [0.70N/mm 4.0lb/inch] (IPC-TM-650 2.4.8)
Peel Strength Standard profile cooper After thermal stress 1.25N/mm 7.0lb/inch [0.80N/mm 4.5lb/inch] (IPC-TM-650 2.4.8.3)
Peel Strength Standard profile cooper At 125 °C 1.25N/mm 7.0lb/inch [0.70N/mm 4.0lb/inch]
Peel Strength Standard profile cooper After process solutions 1.14N/mm 6.5lb/inch [0.55N/mm 3.0lb/inch]
Flexural Strength Lengthwise direction 83,600 lb/inch² (IPC-TM-650 2.4.4)
Flexural Strength Crosswise direction 55,500 lb/inch² (IPC-TM-650 2.4.4)
Tensile Strength Lengthwise direction 55,030 lb/inch²
Tensile Strength Crosswise direction 35,370 lb/inch²
Moisture Absorption 0.5% (IPC-TM-650 2.6.2.1)
Flammability (Laminate & prepreg as laminated) V-0 Rating (UL 94)
Max Operating Temperature 140°C [UL Cert]

Les informations ci-dessus ainsi que les fiches techniques sont fournies a titre indicatif. Seuls les documents remis le jour de la vente peuvent servir de reference.

Télécharger

P26N - Data sheet
Fiche technique du P26N (US)